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LISA : Ultra Low Power Integrated Circuit for Secure RF Applications

Objective of the Project

Lisa The market for contactless and dual interface smartcard is growing in the three main areas of transport, identity and banking. The ergonomic form factor and performance of employed solutions remain key issues on the acceptance by users of deployed offers, and outside the field of telecommunications, the problem remains for the other sectors that are major markets and established, and will arise more acutely (form factor) on emerging markets like smart objects.

Based on this, StarChip and SPS have developed a joint patent with a concept for improving the performance of dual interface card. Thus, the LISA project proposes to finalize this process and develop contactless objects, based on a new RF module. His major objective is to reduce the energy requirement of the current solutions for equal performance. This RF module can be integrated into a smart card in order to address all established markets (Banking, Identity, Transportation) or other types of format.

Project Partners

  • Project leader: Starchip
  • Company: SPS
  • Company: Dolphin Integration
  • Company: Morpho
  • Research Laboratory: IM2NP (Institute of Nanoscience Materials Microelectronics Provence – CNRS Aix Marseille University)
  • Research Laboratory: TIMA (Techniques of Informatics and Microelectronics for integrated systems Architecture – Grenoble INP)

Funding

  • Selection for funding in 2014
  • Call for proposals: FUI AAP17
  • Project duration: 42 months
  • Effort : 57 men/years
  • Funders : BPI, Region PACA, Conseil General des Bouches du Rhone, CPA, European Union via the ERDF (European Regional Development Fund), Community of Aix-en-Provence, Mairie de rousset
  • LISA

 

Expected Benefits

  • 30 jobs created
  • More than € 250M in sales