What's New
Feb 1st, 2012: StarChip® Acquires Contactless Technology through Partnership with CEA-LetiStarChip® expert in designing and qualifying Smart Card ICs, and CEA-Leti, the leading French semiconductor research institute, have signed an agreement to develop a Contactless Front End for Smart Card applications. The Contactless Front End is the result of ... Read More... Dec 20th, 2011: StarChip® achieves first-time-right ESD performance in SIM/Smartcard IC with Sofics TakeCharge® Technology
StarChip® today announced that it has chosen TakeCharge® electrostatic discharge (ESD) technology from Sofics, to protect its newest ICs, which include high voltage on-chip interfaces and must withstand exposure above 4kV Human Body Model (HBM) discharges in their target markets. Read More...
